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ODM Used in Chip Carriers Substrates Flanges and Frames for Power Semiconductor Devices Tungsten Copper Alloy Rod

Name: ODM Used in Chip Carriers Substrates Flanges and Frames for Power Semiconductor Devices Tungsten Copper Alloy Rod
Brand: LUOYANG COMBAT TUNGSTEN & MOLYBDENUM MATERIAL CO., LTD.
SKU: ydWAGSeOwBRo
Price: 54.60 USD
Availability: InStock

ODM Used in Chip Carriers Substrates Flanges and Frames for Power Semiconductor Devices Tungsten Copper Alloy Rod pictures & photos

Application:	Aviation, Electronics, Industrial, Medical, Chemical
Standard:	GB, ASTM
Purity:	>99.95%
Alloy:	Non-alloy
Shape:	Round
Type:	Tungsten Bars

Customization:	Available \| Customized Request

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